Nordson Launches ASYMTEK Vantage XL Dispensing System
The ASYMTEK Vantage® Series is a family of precision dispensing systems developed by Nordson, engineered specifically for advanced semiconductor packaging. These Vantage systems are designed to provide the speed, accuracy, and process control necessary for manufacturers to scale advanced semiconductor packaging, thereby maximizing throughput, yield, and flexibility across various applications.
The series integrates high-speed jetting, intelligent process control, automated calibration, and advanced dispensing technologies. This combination helps manufacturers achieve improved throughput, increased yield, and consistent process performance across wafer, substrate, and panel-level applications. The systems are capable of dispensing into die-to-die gaps smaller than 200 μm and avoiding keep-out zones below 250 μm.
The Vantage® system is optimized for wafer- and substrate-level packaging applications that demand high dispensing accuracy, process flexibility, and high throughput. It supports high-precision processing for 200 or 300 mm wafers, as well as 310 x 310 mm panels. For larger-format requirements, the Vantage® XL variant is specifically optimized for panel-level packaging where throughput, temperature uniformity, and panel flatness are critical for yield, offering large-format processing, integrated thermal management, and high-speed dispensing capabilities.
Specifications
| Product | Wafer Processing | Panel Processing | Dispensing Rate | Vantage XL Panel Processing |
|---|---|---|---|---|
| ASYMTEK Vantage® Series | 200 or 300 mm | 310 x 310 mm | Up to 49,000 DPH with a single IntelliJet valve; up to 90,000 DPH with two IntelliJet valves | Panels up to 510 × 515 mm |
Key Features
- Dispenses into die-to-die gaps below 200 μm.
- Avoids keep-out zones below 250 μm.
- Provides fast, repeatable setup with automated calibration.
- Uses Canvas® dispensing software to simplify programming and process control.
- Provides automated multi-fiducial recognition to improve alignment accuracy.
- Includes integrated post-dispense inspection to reduce scrap and rework.
- Uses confocal height sensing for dispensing on reflective and transparent glass panels.
- Provides patented real-time dispense correction to increase yield.
- Uses closed-loop controls and full traceability to maintain process consistency.
- Provides Industry 4.0-ready connectivity for smart factory integration.
- Vantage XL uses integrated thermal management to minimize warpage and optimize underfill flow.
- Vantage XL uses dual-valve IntelliJet jetting and patented real-time correction to improve dispense accuracy and yield.
Applications
- Advanced semiconductor packaging.
- Wafer-level packaging.
- Substrate-level packaging.
- Panel-level packaging.
- Large-format panel-level packaging.
- Wafer, substrate, and panel-level applications.
- AI applications involving advanced packaging.
- High-performance computing and advanced packaging applications requiring larger package sizes and higher production volumes.
Availability
The ASYMTEK Vantage® Series is available through Nordson Electronics Solutions. Customers can use the product page to connect with Nordson’s sales team for availability and purchasing information.
