Renesas Electronics Corporation released the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC), designed for power efficiency and compactness with a multi-core structure. The…
KYOCERA AVX announces that several VCAS Series Multilayer Varistors (MLVs) are now qualified to both AEC-Q200 and VW80808 standards. These MLVs, featuring automotive-grade…
Nordic Semiconductor announces the nRF54H20, the inaugural System-on-Chip (SoC) in the nRF54H Series, which revolutionizes IoT product development with its compact design,…
CommScope and STMicroelectronics have announced the integration of CommScope’s PKIWorks™ IoT security platform with ST’s STM32WB microcontroller unit (MCU). This collaboration…
Qorvo has introduced its latest cellular Internet of Things (IoT) transmit module, the QM55011. This multi-band multi-mode RF front end (RFFE) module is optimized for NB-IoT1/2…
The LSM6DSL is an iNEMO inertial module from STMicroelectronics that combines a 3D digital accelerometer and a 3D digital gyroscope. It is highly power efficient, using only 0.65…
Espressif Systems has introduced the ESP32-S3-BOX-3, an addition to its development kit range aimed at enhancing prototyping and IoT system building. This AIoT development kit is…
Coral Sense has launched the ABR-WM01-MLG wireless MCU module. Developed for smart buildings, construction, and industry, this module is built with the nRF5340 SoC, which features…
Advantech has introduced the ROM-2620, Open Standard Module (OSM) that aims to transform AIoT (Artificial Intelligence of Things) applications through its ultra-low power…